Display device

ABSTRACT

The aim is to improve the bending resistance a display device. The display device in one embodiment includes a substrate including a first surface and a second surface and a curved part between the first surface and the second surface, a display element arranged on the first surface, a conducting layer connected with the display element and extending to the second surface from the first surface via the curved part, a plurality of protective layers having a lower ductility than the substrate and arranged in the substrate side and/or opposite side to the substrate side with respect to the conducting layer and along the curved part, wherein each of the plurality of protective layers spreading over the curved part, to a certain region of the first surface side from the curved part, and to a certain region of the second side from the curved part.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Application No. 2014-130279, filed on Jun. 25,2014, the entire contents of which are incorporated herein by reference.

FIELD

The present invention is related to a display device and a method ofmanufacturing the display device.

BACKGROUND

A display device which uses liquid crystals or OLED (Organic LightEmitting Diode) is conventionally manufactured by forming a displayelement above a glass substrate. In recent years, display devices arebeing developed which can curve by forming the display element above asubstrate having flexibility (for example, Japanese Laid Open Patent2007-183605).

The radius of curvature when curving a substrate having flexibilitybecomes smaller the greater the load on a layer formed above thesubstrate. The load often leads to defects such as breakage. Inparticular, operational defects occur when a conducting layer breaks.However, from the view point of design and convenience, it is desiredthat the radius of curvature be reduced as much as possible, that is,bending resistance be improved.

The present invention aims to improve the bending resistance of adisplay device.

SUMMARY

One embodiment provides a display device including a substrate includinga first surface and a second surface and a curved part between the firstsurface and the second surface, a display element arranged on the firstsurface, a conducting layer connected with the display element andextending to the second surface from the first surface via the curvedpart, a plurality of protective layers having lower ductility than thesubstrate and arranged in the substrate side and/or opposite side to thesubstrate side with respect to the conducting layer and along the curvedpart, each of the plurality of protective layers spreading over thecurved part, to a certain region of the first surface side from thecurved part, and to a certain region of the second side from the curvedpart.

In addition, one embodiment provides a method of manufacturing a displaydevice including forming a display element, conducting layer and aplurality of protective layers in a substrate including a first surface,a second surface and a curved planned region between the first surfaceand second surface respectively, the display element being formed in atleast the first surface, the conducting layer connecting with thedisplay element and extending to the second surface via the curvedplanned region from the first surface, each of the plurality ofprotective layers having lower ductility than the substrate, beingarranged in the substrate side and/or opposite side to the substrateside with respect to the conducting layer, the protective layerspreading over the curved planned region, to a certain region of thefirst surface side from the curved planned region, and to a certainregion of the second side from the curved planned region, and each ofthe plurality of the protective layers being arranged along the curvedplanned region, curving and fixing the substrate in the curved plannedregion, and baking the substrate.

In addition, one embodiment provides a display device including asubstrate, a display element arranged in the substrate, a conductinglayer connected with the display element and extending in a certaindirection, and a plurality of protective layers having lower ductilitythan the substrate and arranged above a line along a direction differentto a direction in which the conductive layer extends in the substrateside and/or opposite side to the substrate side with respect to theconducting layer.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1A˜FIG. 1B is a planar view showing an outline structure of adisplay device in a first embodiment;

FIG. 2 is a diagram for explaining a protective layer arranged in acurved part in the first embodiment;

FIG. 3 is a diagram for explaining a protective layer arranged in acurved part in the first embodiment;

FIG. 4 is a diagram for explaining another example of a protective layerarranged in a curved part in the first embodiment;

FIG. 5 is a schematic diagram showing a cross-structure of a displaydevice in the first embodiment;

FIG. 6 is a diagram for explaining a process for forming a substrateamong the methods of manufacturing a display device in the firstembodiment;

FIG. 7 is a diagram for explaining a process continuing from FIG. 6among the methods of manufacturing a display device in the firstembodiment;

FIG. 8 is a diagram for explaining a process continuing from FIG. 7among the methods of manufacturing a display device in the firstembodiment;

FIG. 9 is a diagram for explaining a process continuing from FIG. 8among the methods of manufacturing a display device in the firstembodiment;

FIG. 10 is a diagram for explaining a process continuing from FIG. 9among the methods of manufacturing a display device in the firstembodiment;

FIG. 11 is a diagram for explaining a process continuing from FIG. 10among the methods of manufacturing a display device in the firstembodiment;

FIG. 12 is a diagram for explaining a process continuing from FIG. 11among the methods of manufacturing a display device in the firstembodiment;

FIG. 13 is a diagram related to a protective layer in a secondembodiment and explains a positional relationship with another layer;

FIG. 14 is a diagram related to a protective layer in third embodimentand explains a positional relationship with another layer:

FIG. 15 is a diagram related to a protective layer in a fourthembodiment and explains a positional relationship with another layer;and

FIG. 16 is a diagram related to a protective layer in a fifth embodimentand explains a positional relationship with another layer.

DESCRIPTION OF EMBODIMENTS

Each embodiment of the present invention is explained below whilereferring to the diagrams. Furthermore, the disclosure is merely anexample and appropriate modifications could be conceived whilemaintaining the scope of the invention which are also included in thescope of the present invention. In addition, in order to better clarifythe invention, the width and shape etc of each part in drawings aresometimes shown schematically compared to the actual forms and shouldnot be interpreted as limiting the present invention. In addition, inthe specification and each drawing, the same reference symbols areattached to similar elements which have previously been described and adetailed explanation of these elements may be omitted where appropriate.

First Embodiment [Outline Structure]

The display device in one embodiment of the present invention is anorganic EL (Electro-luminescence) display device which uses an OLED.This display device includes flexibility. Furthermore, the displaydevice in the present embodiment is not limited to a self-emitting typedisplay device such as an organic EL display device and may be a liquidcrystal display device using liquid crystals, an electronic paper typedisplay device which uses an electrophoretic element or any otherdisplay device.

The display device uses an organic resin film which includes flexibilityin a substrate. A display element for displaying an image is formedabove the substrate including flexibility (sometimes referred to belowas flexible substrate). A drive element such as a thin film transistor(TFT) for controlling the light emitting state of an OLED is included inthe display element. The flexible substrate is supported by a glasssubstrate when forming a thin film transistor and is peeled from theglass substrate in the manufacturing process of the display device.

[External Appearance of a Display Device 1]

FIG. 1A˜1B are planar diagrams showing a schematic structure of adisplay device 1 in one embodiment. As is shown in FIG. 1A, the displaydevice 1 is arranged with a display region D1, D2, a scanning line drivecircuit 103, a driver IC 104 and a FPC (Flexible Printed Circuit) 106.These are formed in a flexible substrate 10.

The flexible substrate 10 includes a first surface S1 including thefirst display region D1, a second surface S2 including the displayregion D2, and a third surface S3 including the scanning line drivecircuit 103. A display element is formed in the display regions D1, D2.In this way, the display regions D1 and D2 can display an image. Thefirst surface S1 and second surface S2 are curved so that angle ofapproximately 90 degrees is formed. A bent region, that is, a regionbetween the first surface S1 and second surface S2 is referred to ascurved part C (see FIG. 2 for example). The relationship between thefirst surface S1 and third surface S3 is the same as the relationshipbetween the first surface S1 and second surface S2 in that they curve soas to form an angle of approximately 90 degrees. Furthermore, the curvedangle is not limited to 90 degrees and may be 90 degrees or less and 90degree or more.

When a part of a surface curves in this way, for example it is possibleto arrange a display region as large as possible on the largest surfacein a mobile terminal (smartphone etc) having a roughly rectangular caseand form a drive circuit on a side surface. In addition, it is possibleto arrange a display on a side surface. In addition, it is possible toadjust the curved angle of each surface of the display device 1 to theshape of a casing other than a rectangle and arrange a display regionand drive circuit etc.

Furthermore, it is not necessary for a display region to exist on thesecond surface 2 and in this case a drive circuit of a circuit includedin the display region 1 or a device such as a sensor which receivesinputs from a user may be arranged. In addition, a display region mayalso be arranged on the third surface S3. As is shown in FIG. 1A, thepresent invention is not limited to three surfaces, two surfaces or morethan three surfaces may be included.

A case having a fourth surface is exemplified as a case where moresurfaces are included. For example, a fourth surface S4 may be arrangedin an end part (edge facing an edge of the first surface S1 side) of thesecond surface S2. The fourth surface S4 may be formed on another edgeside of the second surface S2 or formed on an edge side opposite the FPC106 of the first surface S1.

Scanning line 101 which extends to the second surface S2 via the firstsurface S1 from the third surface S3 and data signal line 102 whichcrosses perpendicularly with the scanning line 101 are arranged in thedisplay region D1. A pixel 105 is arranged in a position correspondingto an intersection point between the scanning line 101 and the datasignal line 102. The pixel 105 is arranged in a matrix shape.Furthermore, although one signal line extending in a direction along thescanning line 101 or data signal line 102 per pixel 105 is shown in FIG.1A, a plurality of signal lines may also be arranged. In addition,wiring which supplies a certain voltage such as a power source line maybe arranged in the display region D1.

Although a description is omitted in FIG. 1A, a pixel 105 may also bearranged in the display region D2 the same as the display region D1.

The scanning line drive circuit 103 supplies a control signal to ascanning line 101. The driver IC 104 supplies a data voltage to a datasignal line 102 and controls the scanning drive circuit 104. A displayelement including for controlling emitted light based on a controlsignal and a data voltage, and a light emitting element (OLED) which iscontrolled by the pixel circuit are arranged in each pixel 105. Thepixel circuit includes a thin film transistor and capacitor for example,the thin film transistor is driven by a control signal and data voltageand controls the emitted light of a light emitting element. An image isdisplayed in the display regions D1, D2 by control of the emitted light.

In addition, an opposing substrate 20 (see FIG. 5 for example) is bondedto the flexible substrate 10 so as to cover a pixel circuit of eachpixel 105. The opposing substrate 20 is an organic resin layer havingflexibility. A color filter and light blocking material and the like mayalso be formed on the opposing substrate 20. In this example, a filleris filled between the flexible substrate 10 and opposing substrate 20.

FIG. 1B shows a state before the second surface S2 and third surface S3are curved. Each manufacturing process is performed in at least thestated shown in FIG. 1B until a display element is formed in theflexible substrate 10 and the opposing substrate 20 is bonded. Followingthis, the second surface S2 and third surface S3 are curved with respectto the first surface S1 respectively.

In this example, the second surface S2 and third surface S3 are curvedwith respect to the first surface and baked in a state fixed to a metalmold or the like. The driver IC 104 and FPC 106 may be attached to thedisplay device 1 shown in FIG. 1A or attached to the display device 1shown in FIG. 1B,

Next, a region Z1 shown in FIG. 1A, that is, a curved part between thefirst surface S1 and second surface S2 is explained using FIG. 2.

[Structure of a Protection Layer 50]

FIG. 2 is a diagram for explaining a protection layer 50 arranged in acurved part C in the first embodiment. In the explanation below, aregion in which the flexible substrate 10 is curved between the firstsurface S1 and second surface S2 is referred to as curved part C. Ascanning line 101 which is a conducting layer extends to the secondsurface 32 from the first surface S1 via the curved part C. The scanningline 101 is connected with a display element of the display region D1and a display element of the display region D2.

In this example, the protection layer 50 is arranged so as to cover thescanning line 101. The protection layer 50 is formed using a materialwith lower ductility than the flexible substrate 10. For example, in thecase where the flexible substrate 10 is formed using polyimide, theprotection layer 50 is formed using an acrylic resin.

The protection layer 50 covers the scanning line 101 in a certain areaof the curved part C and the first surface S1 side from the curved partC, and a certain area of the second surface S2 side from the curved partC. The certain area of the first surface S1 is an area different to thedisplay region D1 and is determined so as not to overlap the displayregion D1. Similarly, the certain area of the second surface S2 is anarea different to the display region D1 and is determined so as not tooverlap the display region D2.

In the example in FIG. 2, one protection layer 50 is formed with respectto one scanning line 101. In this way, the protection layer 50 is formedin an island shape and is arranged along the curved part C (along theboundary between the first surface S1 and second surface S2 in the caseshown in FIG. 1A). Furthermore, the protection layer 50 may be formed inan island shape and one protection layer 50 may be formed with respectto a plurality of scanning lines 101. As described above, the protectionlayer is formed using a material with lower ductility than the flexiblesubstrate 10. In order to easily curve the flexible substrate 10 in thecurved part C, it is preferred to reduce the area occupied by theprotection layer 50 which is a material with low ductility in the curedpart C. Therefore, while the protection layer 50 is arranged so as tocover the scanning line 101 in the curved part C, it is preferred that aregion in which the protection layer 50 does not exists is arrangedbetween adjacent scanning lines 101.

In addition, it is possible to suppress peeling of the protection layer50 from the flexible substrate 10 by spreading the protection layer 50up to the first surface S1 and second surface S2 from the curved part C.On the other hand, when the protection layer 50 is spread widely in thefirst surface S1 and second surface S2, the effects of stress producedin the curved part C are transmitted to other regions (for example,display regions D1 and D2). Therefore, it is preferred that theprotection in the first surface S1 and second surface S2 does not ad asfar as the display regions D1, D2.

In addition, it order to suppress peeling of the protection layer 50from the flexible substrate 10, it is preferred that a pattern peripheryedge part of the protection layer 50 does not include an angle.Therefore, as is shown in FIG. 2, it is preferred that the four corner500 of a pattern are formed into curved lines and the pattern peripheryedge part of the protection layer 50 is formed into a pattern which isenclosed by lines which do not have a vertex.

FIG. 3 is a diagram for explaining the protection layer 50 in a curvedpart in the first embodiment. FIG. 3 shows the protection layer 50 in astate before the second surface S2 and third surface S3 shown in FIG. 1Bare curved. As is shown in FIG. 3, in the case where the first surfaceS1 and second surface S2 are positioned on the same planar surface, thecurved part C is the region intended to be curved (referred to below ascurved planned region). The scanning line 101 extends across the curvedplanned region. In addition, the protection layer 50 is formed in astraight line in a different direction to the direction in which thescanning line 101 extends. The curved planned region spreads along thestraight line.

The substrate changes into the shape shown in FIG. 2 when the flexiblesubstrate 10 is curved in the direction of the arrow in FIG. 3. At thistime, a force is applied in to the scanning line in a pulling direction(direction in which it is easily broken), On the other hand, byproviding the protection layer 50 which has lower ductility than theflexible substrate 10 in the curved part C, the protection layer 50produces a force in a direction which compresses the flexible substrate10. Therefore, it is possible to relieve the force whereby the flexiblesubstrate 10 pulls the scanning line 101.

When the flexible substrate 10 is baked in a curved state, the stressapplied to an organic resin such as the flexible substrate 10 andprotection layer 50 is relieved. In this way, the shape of the flexiblesubstrate 10 can be easily maintained in a curved state.

FIG. 4 is a diagram for explaining another example of a protection layerarranged in a curved part C in the first embodiment. In the exampledescribed above, the protection layer 50 covers the scanning line 101,that is, the protection layer 50 is arranged further to the oppositeside (referred to simply as upper layer side below) of the flexiblesubstrate 10 than the scanning line 101. On the other hand, reversely,the protection layer 50 may be arranged further to the flexiblesubstrate 10 side (referred to simply as lower layer side below) thanthe scanning layer 101. Even in this case, the protection layer 50 addsa force in the direction where the flexible substrate 10 is compressed.Therefore, it is possible for the flexible substrate 10 to relieve theforce which pulls the scanning line 101.

Furthermore, by combining FIG. 2 and FIG. 4, the protection layer 50 maybe arranged on both sides (upper layer side and lower layer side) of thescanning line 101. The positional relationship between the protectionlayer 50 and scanning line 101 is described in detail below.

[Cross-Sectional Structure of the Display Device 1]

FIG. 5 is a schematic diagram showing a cross-sectional structure of adisplay device in the first embodiment. In FIG. 5 and FIG. 6 to FIG. 12described below, D1, D2, S1, S2, S3 and C correspond to the displayregion D1, first surface S1, second surface S2, third surface S3 andcurved part C described above. In addition, TA refers to a regionarranged with terminal connected to the exterior parts such as FPC 106and the like.

A thin film transistor 110 is arranged in the flexible substrate 10. Aninterlayer insulation layer 111 is arranged so as to cover the thin filmtransistor 110. A wiring layer 112 is arranged above the interlayerinsulation layer 111. The wiring layer 112 is connected to the thin filmtransistor 110 via a contact hole arranged in the interlayer insulationlayer 111.

An interlayer organic layer 151 is arranged to cover a wiring layer 112in the display region D1 and a pixel electrode layer 114 is arrangedabove the interlayer organic layer 151. The pixel electrode layer 114 isconnected to the wiring layer 12 via a contact hole arranged in theinterlayer organic layer 151. A rib organic layer 153 is arranged toexpose a part of the pixel electrode layer 114 and cover an end part ofthe pixel electrode layer 114. A light emitting layer 120 is arranged tobe connected with the exposed pixel electrode layer 114.

The light emitting layer 120 includes an OLED, a translucent electrodewhich allows light to pass through from the ° LED, and a sealing layerwhich seals the OLED and translucent electrode. In this example, when acurrent is supplied to the OLED via the translucent electrode and pixelelectrode layer 114, light from the OLED passes through the translucentelectrode and is emitted to the opposing substrate 20 side. Thisstructure is generally called a top emission type structure.Furthermore, the reverse of the top emission type structure may beadopted in which light is emitted to the flexible substrate 10 sidecalled a bottom emission type structure.

These structures which exist in the display region D1 correspond to adisplay element.

The interlayer organic layer 151 is removed in the vicinity of thecurved part C and the wiring layer 112 and pixel electrode layer 114 arestacked. In this example, the scanning line 101 is formed using thestacked structure of the wiring layer 112 and pixel electrode layer 114.The rib organic layer 153 corresponding to the protection layer 50described above is formed above the pixel electrode layer 114 in thecurved part C and a certain region of the first surface S1 side from thecurved part C, and a certain region of the second side surface S2 fromthe curved part C.

In a region which includes at least the display regions D1, D2 exceptthe terminal region TA in FIG. 5 (in this example, a region whichfurther includes the vicinity of the curved part C), each structurewhich exists in each region is covered by the opposing substrate 20. Afiller 170 is filled between each structure formed on the opposingsubstrate 20 and flexible substrate 10 side. Furthermore, a sealingmaterial may be arranged so as to enclose the filler 170 along theperiphery edge part of the opposing substrate 20.

Furthermore, the second surface S2 has the same structure as the displayregion D1. In addition, the third surface S3 has a structure using apart of a display element of the display region D1 in which a drivecircuit etc is formed using the thin film transistor 110. A similarstructure as the curved part C between the first surface S1 and secondsurface S2 exists in the curved part C between the first surface S1 andthird surface S3.

[Manufacturing Method of the Display Device 1]

Next, a manufacturing method of the display device 1 described above isexplained using FIG. 6 to FIG. 12.

FIG. 6 is a diagram for explaining a process for forming a substrate inthe manufacturing method of the display device 1 in the firstembodiment. The flexible substrate 10 is formed above a glass substrate30. The flexible substrate 10 is an organic resin layer and in thisexample is formed from polyimide. For example, the flexible substrate 10is formed on the glass substrate 30 by coating and baking a solutioncontaining polyimide above the glass substrate 30. The thickness of theflexible substrate 10 is 1 μm or more and 100 μm or less and preferably5 μm or more and 50 μm or less. Furthermore, the flexible substrate 10is not limited to polyimide and may be formed from another organic resinlayer. However, the flexible substrate 10 is preferred to be formed froma material having a maximum temperature (at least 300° C., preferably400° C.) heat resistance in a thermal process when forming the thin filmtransistor 110.

The glass substrate 30 is used as a support substrate for supporting theflexible substrate 10 when forming a display element and the like in theflexible substrate 10. Furthermore, it is not always necessary to use asupport substrate.

FIG. 7 is a diagram for explaining a process continuing from FIG. 6 inthe manufacturing method of the display device in the first embodiment.The thin film transistor 110 is formed in the flexible substrate 10. Asilicon oxide or silicon nitride insulation layer is formed between theflexible substrate 10 and thin film transistor 110. The infiltration ofmoisture or gas to the interior is suppressed by this insulation layer.

Next, the interlayer insulation layer 111 is formed so as to cover thethin film transistor 110. The interlayer insulation layer 111 may beformed by a silicon oxide or silicon nitride insulation layer or aninsulation layer using an organic resin.

FIG. 8 is a diagram for explaining a process continuing from FIG. 7 inthe manufacturing method of the display device in the first embodiment.A part of the interlayer insulation layer 111 formed as described aboveis etched and a part (source and drain of a semiconductor layer and gateelectrode etc) of the thin film transistor 110 is exposed. In addition,the wiring layer 112 is formed into a certain pattern after etching theinterlayer insulation layer 111. The wiring layer 112 is a conductinglayer such as the scanning line 101 or data signal line 102 describedabove and is connected with the thin film transistor 110 exposed in aregion where the interlayer insulation layer 111 is etched. Thisconducting layer is formed by stacking a metal such as aluminum ortitanium for example.

FIG. 9 is a diagram for explaining a process continuing from FIG. 8 inthe manufacturing method of the display device in the first embodiment.A part of the wiring layer 112 is exposed and the interlayer organiclayer 151 is formed. In this example, the interlayer organic layer 151is an acrylic resin. The interlayer organic layer 151 is formed bycoating a photosensitive acrylic resin on the flexible substrate 10formed with each structure described above a certain pattern is formedby exposing, developing and baking.

Furthermore, the interlayer organic layer 151 is not limited to acrylicresin and may be formed using another organic resin. However, theinterlayer organic layer 151 is preferred to be a material with lowerductility than the flexible substrate 10. As in the embodimentsdescribed below, in the case where the interlayer organic layer 151 isused as the protection layer 50, a material with lower ductility thanthe flexible substrate 10 is used for the interlayer organic layer 151.The thickness of the interlayer organic layer 151 is 0.5 μm or more and10 μm or less for example, and preferably 1 μm or more and 5 μm or less.

FIG. 10 is a diagram for explaining a process continuing from FIG. 9 inthe manufacturing method of the display device in the first embodiment.The pixel electrode layer 114 is formed above the interlayer organiclayer 151 formed with the pattern described above. In this example, ametal oxide such as ITO (Indium Tin Oxide) is used for the pixelelectrode layer 114 and an anode electrode of the OLED is formed. Inaddition, in this example, the pixel electrode layer 114 is arrangedabove the wiring layer 112 in the vicinity of the curved part C to formthe scanning line 101 using a stacked structure. Furthermore, thescanning line 101 may be formed in either the wiring layer 112 or pixelelectrode layer 114 in the vicinity of the curved part C.

FIG. 11 is a diagram for explaining a process continuing from FIG. 10 inthe manufacturing method of the display device in the first embodiment.A part of the pixel electrode layer 114 is exposed and the rib organiclayer 153 is formed. In this example the rib organic layer 153 is anacrylic resin. The rib organic layer 153 is formed by coating aphotosensitive acrylic resin on the flexible substrate 10 formed witheach structure described above and a desired pattern is formed byexposing, developing and baking. Furthermore, the rib organic layer 153is not limited to an acrylic resin and can be formed from anotherorganic resin. However, the rib organic layer 153 used as the protectionlayer 50 is required to be a material with lower ductility than theflexible substrate 10. Furthermore, the rib organic layer 153 is notlimited to this structure in the case where the rib organic layer 153 isnot used as the protection layer 50 as is described in the embodimentsbelow. The thickness of the rib organic layer 153 is 0.5 μm or more and10 μm or less for example, and preferably 1 μm or more and 5 μm or less.

The rib organic layer 153 is formed so as to cover the periphery edgepart of the pixel electrode layer 114 in the display region D1. Inaddition, the rib organic layer 153 is arranged in the curved part C andacross a certain region on both sides of the curved part C in thevicinity of the curved part C and the protection layer 50 describedabove is formed.

FIG. 12 is a diagram for explaining a process continuing from FIG. 11 inthe manufacturing method of the display device in the first embodiment.The light emitting layer 120 is formed after forming the rib organiclayer 153. Following this, a display element of at least the displayregion D1 and D2 is sealed by the opposing substrate 20. An acrylicresin filler 170 is filled between the opposing substrate 20 andflexible substrate 10 when sealing is performed. Furthermore, in thisexample the vicinity of the curved part C is also sealed by the opposingsubstrate 20.

The opposing substrate 20 is formed from a material having flexibilitysuch as an organic resin layer the same as the flexible substrate 10. Acolor filter and light blocking layer and the like may also be formed inthe opposing substrate 20.

Following this, light such as a laser is irradiated from the glasssubstrate 30 side towards to the flexible substrate 10 and the glasssubstrate 30 is peeled from the flexible substrate 10. When laser lightis irradiated from the glass substrate 30 side, the laser light isabsorbed by the organic resin layer at the boundary between the flexiblesubstrate 10 and glass substrate 30 and heated. In this way, the organicresin layer breaks up, an adhesive force between the glass substrate 30and the flexible substrate 10 is weakened and peeling becomes possible.In this way, the display device 1 shown in FIG. 1B and FIG. 5 ismanufactured.

In addition, as described above the display device 1 shown in FIG. 1A iscompleted when the second surface S2 and third surface S3 are cured andfixed with respect to the first surface S1 and baked while in a fixedstate. The baking temperature is 60° C. or more and 250° C. or less. Inthe case where an OLED is used in the display element, it is preferredthat the sintering temperature is 60° C. or more and 100° C. or less andmore preferably 70° C. or more and 80° C. or less considering the heatresistance of the OLED. Furthermore, in the case where a material withhigh heat resistance is used in the display element, or in the case whenbaking described above is performed before forming a material (OLED forexample) with low heat resistance included in the display element, thebaking temperature is 200° C. or more and 240° C. or less and morepreferably 220° C. or more and 230° C. or less.

As described above, when the second surface S2 and third surface S3 arecurved with respect to the first surface S1, the scanning line 101 isapplied with a force in a pulling direction (direction in which itbreaks easily) due to the effects of the thickness of the flexiblesubstrate 10. As in the first embodiment, by providing the protectionlayer 50 which has lower ductility than the flexible substrate 10 in thecurved part C, the protection layer 50 generates a force in thedirection in which the flexible substrate 10 is compressed. Therefore,it is possible for the flexible substrate 10 to relieve the forcepulling the scanning line 101. In this way, in the case where a curvedregion is determined in advance, by arranging the protection layer 50corresponding to a position of a conducting layer such as the scanningline 101, it is possible to improve bending resistance properties ofthis region.

Second Embodiment

The interlayer organic layer 151 is used as the protection layer 50 inthe second embodiment.

FIG. 13 is related to the protection layer 50 in the second embodimentand explains a positional relationship with other layers. As is shown inFIG. 13, the interlayer organic layer 151 is used as the protectionlayer 50 and the pixel electrode layer 114 is provided (corresponding toFIG. 4) above the protection layer 50, That is, in this example theprotection layer 50 is sandwiched between the pixel electrode layer 114and wiring layer 112.

In this case, the interlayer organic layer 151 is formed with a materialhaving lower ductility than the flexible substrate 10. By adopting thisstructure, the load on the scanning layer 101 (wiring layer 112 andpixel electrode layer 114) in the curved part C is reduced by providingthe protection layer 50 and it is possible to improve bending resistanceproperties.

Third Embodiment

The interlayer organic layer 151 and rib organic layer 153 are used asthe protection layer 50 in the third embodiment.

FIG. 14 is related to the protection layer 50 in the third embodimentand explains a positional relationship with other layers. As is shown inFIG. 14, the interlayer organic layer 151 and rib organic layer 153 areprovided in the vicinity of the curved part C and these form theprotection layer 50. In this example, the interlayer organic layer 151is spread wider than the rib organic layer 153. The rib organic layer153 is provided only in the interior of the curve part C.

In this example, the pixel electrode layer 114 is sandwiched between theinterlayer organic layer 151 and the rib organic layer 153. That is, thepixel electrode layer 114 is sandwiched by the protection layer 50.

The interlayer organic layer 151 and rib organic layer 153 are formedwith a material having lower ductility than the flexible substrate 10.Furthermore, the rib organic layer 153 may be formed with a materialhaving lower ductility than the interlayer organic layer 151 as well asthe flexible substrate 10.

By adopting this structure, the load on the scanning line 101 (wiringlayer 112 and pixel electrode layer 114) in the curved part C is reducedby providing the protection layer 50 and it is possible to improvebending resistance properties.

Fourth Embodiment

The size relationship of the interlayer organic layer 151 and riborganic layer 153 in the third embodiment is in a reverse relationshipin the fourth embodiment.

FIG. 15 is related to the protection layer 50 in the fourth embodimentand explains a positional relationship with other layers. As is shown inFIG. 15, the interlayer organic layer 151 and rib organic layer 153 areprovided in the vicinity of the curved part C and these form theprotection layer 50. In this example, the rib organic layer 153 isspread wider than the interlayer organic layer 151. The interlayerorganic layer 151 is provided only in the interior of the curve part C.

In this example, the pixel electrode layer 114 is sandwiched between theinterlayer organic layer 151 and the rib organic layer 153. That is, thepixel electrode layer 114 is sandwiched by the protection layer 50.

The interlayer organic layer 151 and the rib organic layer 153 are eachformed with a material having material having lower ductility than theflexible substrate 10. Furthermore, the rib organic layer 153 may beformed with a material having lower ductility than the interlayerorganic layer 151 as well as the flexible substrate 10.

By adopting this structure, the load on the scanning line 101 (wiringlayer 112 and pixel electrode layer 114) in the curved part C is reducedby providing the protection layer 50 and it is possible to improvebending resistance properties.

Fifth Embodiment

The interlayer organic layer 151 and rib organic layer 153 in the thirdand fourth embodiments are spread from the curved part C to the firstsurface S1 side and second surface S2 side respectively in the fifthembodiment.

FIG. 16 is related to the protection layer 50 in the fifth embodimentand explains a positional relationship with other layers. As is shown inFIG. 16, the interlayer organic layer 151 and rib organic layer 153 areprovided in the vicinity of the curved part C and these form theprotection layer 50. In this example, the rib organic layer 153 isspread wider than the interlayer organic layer 151. Either theinterlayer organic layer 151 or the rib organic layer 153 are spreadfrom the curved part C to the first surface S1 side and the secondsurface S2 side. Furthermore, the size relationship between theinterlayer organic layer 151 and rib organic layer 153 may be a reverserelationship.

In this example, the pixel electrode 114 is sandwiched in at least theentire curved part C by the interlayer organic layer 151 and rib organiclayer 153, That is, the pixel electrode 114 is sandwiched by theprotection layer 50 in at least the entire curved part C.

The interlayer organic layer 151 and the rib organic layer 153 are eachformed with a material having material having lower ductility than theflexible substrate 10. Furthermore, the rib organic layer 153 may beformed with a material having lower ductility than the interlayerorganic layer 151 as well as the flexible substrate 10.

By adopting this structure, the load on the scanning line 101 (wiringlayer 112 and pixel electrode layer 114) in the curved part C is reducedby providing the protection layer 50 and it is possible to improvebending resistance properties. Since the pixel electrode 114 is easierto break in the case where it is formed from a metal oxide rather than ametal layer, it is possible to further improve bending resistanceproperties by sandwiching the pixel electrode layer 114 between an upperand lower layer using the protection layer 50 in the entire curved partC.

In the category of the concept of the present invention, a personordinarily skilled in the art could conceive of various modificationsand correction examples and could understand that these modificationsand correction examples belong to the scope of the present invention.For example, with respect to each embodiment described above, a personordinarily skilled in the art could appropriately perform an addition orremoval of structural components or design modification or an additionof processes or an omission or change in conditions which are includedin the scope of the present invention as long as they do not depart fromthe subject matter of the present invention.

What is claimed is:
 1. A display device comprising: a substrateincluding a first surface and a second surface and a curved part betweenthe first surface and the second surface; a display element beingarranged on the first surface; a conducting layer connected with thedisplay element and extending to the second surface from the firstsurface via the curved part; a first organic protective layer at leastpartially on the conducting layer in the curved part; and a resin layeron the first organic protective layer and the conductive layer, whereinthe conducting layer includes a first conductive layer and a secondconductive layer on the first conductive layer, the second conductivelayer is arranged on the first organic protective layer so that thefirst organic protective layer is sandwiched by the first conductivelayer and the second conductive layer in the curved part, the firstconductive layer is directly in contact with the second conductive layerin the first surface and the second surface, and the first conductivelayer and the second conductive layer are separated by the first organicprotective layer in the curved part.
 2. The display device according toclaim 1, further comprising a second organic protective layer arrangedon the second conductive layer in the curved part.
 3. The display deviceaccording to claim 2, wherein the resin layer covers the second organicprotective layer.
 4. The display device according to claim 2, wherein afirst part of the second organic protective layer covers a first sideportion of the first organic protective layer in the first surface, anda second part of the second organic protective layer covers a secondside portion of the first organic protective layer in the secondsurface.
 5. The display device according to claim 1, wherein theconducting layer includes a metal oxide.
 6. The display device accordingto claim 1, wherein the substrate and the first organic protective layerare organic resins.
 7. The display device according to claim 1, whereinthe substrate is polyimide and the first organic protective layer isacrylic resin.
 8. A display device comprising: a substrate including afirst portion, a second portion, and a curved portion between the firstportion and the second portion; pixels arranged in a matrix on the firstportion, each of the pixels including an organic light emitting elementand a pixel circuit connected to the organic light emitting element; adrive circuit arranged on the second portion; conductive layers whichare arranged on the curved portion and connect pixels to the drivecircuit; and a first organic protective layer at least partially on theconductive layers in the curved part; and a resin layer on the firstorganic protective layer and the conductive layers, wherein each of theconductive layers includes a first conductive layer and a secondconductive layer on the first conductive layer, the second conductivelayer is arranged on the first organic protective layer so that thefirst organic protective layer is sandwiched by the first conductivelayer and the second conductive layer in the curved part, the firstconductive layer is directly in contact with the second conductive layeron the first portion and the second portion, and the first conductivelayer and the second conductive layer are separated by the first organicprotective layer in the curved part.
 9. The display device according toclaim 8, further comprising a second organic protective layer arrangedon the second conductive layer in the curved part.
 10. The displaydevice according to claim 9, wherein the resin layer covers the secondorganic protective layer.
 11. The display device according to claim 9,wherein a first part of the second organic protective layer covers afirst side portion of the first organic protective layer in the firstsurface, and a second part of the second organic protective layer coversa second side portion of the first organic protective layer in thesecond surface.
 12. The display device according to claim 8, wherein theconductive layers include a metal oxide.
 13. The display deviceaccording to claim 8, wherein the substrate and the first organicprotective layer are organic resins.
 14. The display device according toclaim 8, wherein the substrate is polyimide and the first organicprotective layer is acrylic resin.